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2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

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Dongguan Ziitek Electronical Material and Technology Ltd.

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2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Name: 26WMK Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module
Brand: Ziitek
Price: 0.1 USD

Wholesale 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module from china suppliers

Brand Name : Ziitek

Model Number : TIF520BS

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Application : Graphics Card Thermal Module

Thickness : 0.020"(0.5mm)

Specific Gravity : 3.0g/cc

Dielectric Breakdown Voltage : >5500 VAC

Thermal conductivity : 2.6W/m-K

Color : Blue

Operating Temp : -45~200℃

Keywords : Thermal Pad

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2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product introduction

TIF^TM520BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features
> Good thermal conductive: 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF^TM520BS Series
Property	Value	Test method
Color	Blue	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Thickness range	0.020"(0.5mm)	ASTM D374
Hardness	13 Shore 00	ASTM 2240
Specific Gravity	3.0 g/cc	ASTM D792
Continuos Use Temp	-45 to 200℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	5.0 MHz	ASTM D150
Volume Resistivity	2.0X10¹³Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	2.6W/m-K	ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

2.6W/M.K Cooling Gap Filler

Insulation Silicone Sheet Thermal Pad

Graphics Card Thermal Module Thermal Pad

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module Images